发明名称 |
ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME |
摘要 |
An adhesive composition which can reconcile, to a high degree, process characteristics including suitability for filling on an adherend (suitability for infiltration) and suitability for low-temperature laminating with semiconductor device reliability such as reflow resistance; and a filmy adhesive, an adhesive sheet having excellent process characteristics including easy strippability from dicing sheets, and a semiconductor device having excellent productivity, high adhesion strength at high temperatures, and excellent moisture resistance which each comprises or is produced with the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by the following general formula (I), and (C) a (meth)acrylate compound having a functionality of 2 or higher. (Chemical formula 1) (I) (In the formula, R<SUB>1</SUB> is a divalent organic group comprising an aromatic ring and/or a linear, branched, or cyclic aliphatic hydrocarbon.) |
申请公布号 |
WO2007083810(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
WO2007JP50985 |
申请日期 |
2007.01.23 |
申请人 |
HITACHI CHEMICAL CO., LTD.;MASUKO, TAKASHI;MIYAHARA, MASANOBU;OKUBO, KEISUKE |
发明人 |
MASUKO, TAKASHI;MIYAHARA, MASANOBU;OKUBO, KEISUKE |
分类号 |
C09J4/02;C09J4/06;C09J7/00;C09J7/02;H01L21/301 |
主分类号 |
C09J4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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