| 摘要 |
A polyimide film is provided to have low hygroscopicity, a low moisture absorption expansion coefficient, and high modulus of elasticity suitable for use as base films for TAB tapes and COF, and to have improved elongation. The polyimide film is obtained by imidizing polyamic acid prepared from diamines and dianhydride and has an elongation of 50-150%, a tensile modulus of 4-8GPa, a tensile strength of 150-500MPa, and a moisture absorption rate of 5% or less. The dianhydride contains biphenylcarboxylic anhydride or a derivative thereof and pyromellitic dianhydride or a derivative thereof. The diamines contain phenylenediamine or a derivative thereof and diaminophenylether or a derivative thereof.
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