发明名称 Solder component assembly
摘要 <p>The component (10) has an insulating body (20), where a contact unit (51) is fastened to the insulating body. The contact unit has a soldering part for soldering contact pads of a printed circuit board. The soldering part has a soldering surface, which is arranged partially at the insulating body. The soldering surface is continuously designed under an angle opposite to a surface of the soldering surface of the printed circuit board.</p>
申请公布号 EP1811822(A2) 申请公布日期 2007.07.25
申请号 EP20070001174 申请日期 2007.01.19
申请人 AMPHENOL-TUCHEL ELECTRONICS GMBH 发明人 DOERR, MARTIN;NIEDENZU, VOLKER;KUNTZ, JULIO
分类号 H05K3/34 主分类号 H05K3/34
代理机构 代理人
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