发明名称 |
Solder component assembly |
摘要 |
<p>The component (10) has an insulating body (20), where a contact unit (51) is fastened to the insulating body. The contact unit has a soldering part for soldering contact pads of a printed circuit board. The soldering part has a soldering surface, which is arranged partially at the insulating body. The soldering surface is continuously designed under an angle opposite to a surface of the soldering surface of the printed circuit board.</p> |
申请公布号 |
EP1811822(A2) |
申请公布日期 |
2007.07.25 |
申请号 |
EP20070001174 |
申请日期 |
2007.01.19 |
申请人 |
AMPHENOL-TUCHEL ELECTRONICS GMBH |
发明人 |
DOERR, MARTIN;NIEDENZU, VOLKER;KUNTZ, JULIO |
分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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