| 摘要 |
The microphone package 200 comprises a substrate 210, a sound processing unit 220, bonding pads 230, bonding wires 240 and an upper cap 260. There is at least one trench or connective area 211 on the substrate. The bonding pads and the trench or connective area lie in different planes on the substrate (figs 6, 7, 9 to 12). For example the trench or connective area 211 may be inclined or stepped with respect to the bonding pads 230. Connective paste is smeared on the surface of the substrate, in the trench or connective area 211 and the cap 260 is placed on the substrate 210. This kind of package structure prevents a short circuit at the bonding pads 230 being caused by the overflowing of the connective paste. |
