| 摘要 |
A digital demodulator package of SIP(System In package) type is provided to arrange electrode pads for interfacing a tuner portion and an MPEG portion irrespective of a broadcasting mode. A wafer chip(120) for a digital demodulator is mounted on a substrate(110), and a circuit pattern(130) is formed on the substrate, and is electrically connected to the wafer chip. At least one device(140) is mounted on the substrate, and is electrically connected to the circuit pattern. Plural electrode pads are formed on the substrate, and are electrically connected to the circuit pattern. The electrode pads are electrically connected to the wafer chip or device.
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