DIE ATTACH SYSTEM AND METHOD OF ATTACHING DIES USING THE SAME

摘要

A die attach system and a die attach method using the same are provided to prevent voids and an air trap by using a groove pattern formed on an adhesive film through an ejecting tool. An upper surface of a semiconductor chip is chucked by using a pick-up tool(S10). The semiconductor chip is attached on a tape by using an adhesive film. The tape opposite to the semiconductor chip is pushed up by using an ejecting tool to form a groove pattern on the adhesive film(S20). The pick-up tool is raised so that the semiconductor chip is separated from the tape together with the adhesive film on which the groove pattern has been formed(S30). The semiconductor chip on which the adhesive film is attached is attached on a package substrate by using the pick-up tool(S40). Voids between the package substrate and the adhesive film are removed through the groove pattern.