| 摘要 |
A substrate processing method, a substrate processing apparatus, and a method for fabricating a semiconductor device are provided to obtain a wiring pattern with high dimensional precision and good pattern shape by using a wafer that is applied with hydrophobic treatment. While a liquid is supplied between a processing target substrate which is subjected to exposure treatment and a projection optical system(4) of an exposure apparatus for performing the exposure treatment, at least hydrophobic treatment is applied to a region in a predetermined range from a peripheral rim part of a second main face opposite to a first main face, before a resist film is formed on the first main face of the processing target substrate that is provided for liquid immersion exposure for carrying out the exposure treatment at a side to be applied with the exposure treatment. |
