发明名称 |
Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same |
摘要 |
A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. A heat-dissipating unit composed of a plurality of heat-dissipating fins is assembled to a concave portion of the isothermal plate assembly of the predetermined shape. The upper plate and the lower plate are assembled with outer coupling unit and then a hot melting process is executed. The resultant product is then cooled to form a finished heat-dissipating device with an isothermal plate assembly of predetermined shape. |
申请公布号 |
EP1681911(B1) |
申请公布日期 |
2007.07.25 |
申请号 |
EP20050000860 |
申请日期 |
2005.01.17 |
申请人 |
CPUMATE INC. |
发明人 |
LIN, KUO-LEN;TSUI, HUI-MIN;HSU, KEN |
分类号 |
H05K7/20;F28D15/02;H01L23/46 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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