Inductor apparatus

摘要

The present invention provides a multi-layer inductor structure. A metal film is used to form the coils. The dielectric material of the inductor in the present invention is air or the printed circuit board. The metal film surrounding a point is formed in a multi-layer printed circuit board. The multi-layer inductor structure occupies a smaller area in the motherboard but has the same inductance compared with a single layer inductor structure.