发明名称 |
REFRACTORY METAL SUBSTRATE WITH IMPROVED THERMAL CONDUCTIVITY |
摘要 |
<p>A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second major surface and a plurality of openings extending, at least partially, from the first major surface to the second major surface; and a Group IB metal from the periodic table of the elements or other high thermally conductive material filling at least a portion of the space encompassed by at least some of the openings; and optionally, a layer containing a Group IB metal from the periodic table or other high thermally conductive material disposed over at least a portion of the first major surface and at least a portion of the second major surface.</p> |
申请公布号 |
EP1810330(A2) |
申请公布日期 |
2007.07.25 |
申请号 |
EP20050814799 |
申请日期 |
2005.10.27 |
申请人 |
H.C. STARCK INC. |
发明人 |
BREIT, HENRY, F.;WU, RONG-CHEN, RICHARD;KUMAR, PRABHAT |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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