发明名称 REFRACTORY METAL SUBSTRATE WITH IMPROVED THERMAL CONDUCTIVITY
摘要 <p>A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second major surface and a plurality of openings extending, at least partially, from the first major surface to the second major surface; and a Group IB metal from the periodic table of the elements or other high thermally conductive material filling at least a portion of the space encompassed by at least some of the openings; and optionally, a layer containing a Group IB metal from the periodic table or other high thermally conductive material disposed over at least a portion of the first major surface and at least a portion of the second major surface.</p>
申请公布号 EP1810330(A2) 申请公布日期 2007.07.25
申请号 EP20050814799 申请日期 2005.10.27
申请人 H.C. STARCK INC. 发明人 BREIT, HENRY, F.;WU, RONG-CHEN, RICHARD;KUMAR, PRABHAT
分类号 H01L23/373 主分类号 H01L23/373
代理机构 代理人
主权项
地址