发明名称 |
Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
摘要 |
A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips. |
申请公布号 |
ZA200602266(B) |
申请公布日期 |
2007.07.25 |
申请号 |
ZA20060002266 |
申请日期 |
2006.03.17 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
RUBINSZTAJN, SLAWOMIR;GIBSON, III, DAVID A;PRABHAKUMAR, ANANTH;TONAPI, SANDEEP;CAMPBELL, JOHN |
分类号 |
C01B;C08K;C08K9/06;C08L63/00;C09C1/30;H01L;H01L21/56;H01L23/29 |
主分类号 |
C01B |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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