| 摘要 |
A gas distribution plate for controlling gas distribution and a substrate processing apparatus including the same are provided to improve uniformity of plasma and radical in a chamber by precisely controlling flow rate of materials sprayed in the chamber. A gas distribution plate is positioned over a substrate to spray a gas onto the substrate. A first gas flow path is formed in a center portion of one surface of the substrate. A second gas flow path is formed around the first gas flow path, and is not communicated with the first gas flow path. A third gas flow path is formed around the second gas flow path, and is not communicated with the first and the second gas flow. A lower plate(130a) is formed with plural spray holes, and an upper plate(130b) is in close contact with an upper portion of the lower plate.
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