| 摘要 |
A single crystal silicon wafer for use in the production of insulated gate bipolar transistors is made of single crystal silicon grown by the Czochralski method and has a gate oxide with a film thickness of from 50 to 150 nm. The wafer has an interstitial oxygen concentration of at most 7.0×10 17 atoms/cm 3 , a resistivity variation within the plane of the wafer of at most 5% and, letting t ox (cm) be the gate oxide film thickness and S (cm 2 ) be the electrode surface area when determining the TZDB pass ratio, a density d (cm -3 ) of crystal originated particles (COP) having a size at least twice the gate oxide film thickness which satisfies the formula d ‰ -ln(0.9)/(S·t ox /2). The wafers have an increased production yield and a small resistivity variation. |
