| 摘要 |
The present invention was held in order to resolve problems on above-mentioned conventional wire bumping material.
This invention has the following purposes;
(1) approximating Au-Ag alloy bumping balls to bond Al pads to ideal sphere shape
(2) increasing assurance of Au-Ag alloy bump bonding to Al pads
(3) shortening tail length of Au-Ag alloy bump
(4) improving anti-Au consumption into solder
(5) decreasing contamination of capillary tip by bump wire and hole around tip Means for resolution Au-Ag alloy for wire bumping comprising wherein Au, which purity is more than 99.99 mass %, comprising Au matrix and a particle of additive elements, consisting of 1 to 40 mass % Ag, which purity is more than 99.99 mass %. |
