发明名称 |
Foamable underfill encapsulant |
摘要 |
<p>A thermoplastic or thermosetting B-stageable or pre-formed film underfill encapsulant composition that is used in the application of electronic components to substrates. The composition comprises a resin system comprising thermoplastic or thermally curable resin, an expandable microsphere, a solvent, and optionally a catalyst. Various other additives, such as adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant may be dried or B-staged to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly.</p> |
申请公布号 |
EP1811554(A2) |
申请公布日期 |
2007.07.25 |
申请号 |
EP20070000896 |
申请日期 |
2007.01.17 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
SHAH, JAYESH;MORGANELLI, PAUL;PEARD, DAVID |
分类号 |
H01L21/56;C08J9/32;C08K3/04;C08L1/00;H01L23/29;H05K3/30 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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