| 摘要 |
<p>The invention provides a multilayered printed circuit board (700) comprising a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition, and a solder resist layer formed further thereon as an outermost layer, with a connection of said conductor circuits through said interlaminar resin insulating layer being performed by a via-hole, wherein via-holes in different level layers among said via-holes are piled (207a,b,c) on one another, and among said piled via-holes, at least one via-hole (207d) is piled on other via-holes with its center deviated from other via-holes, and other via-holes are piled on one another with those centers approximately overlapped with one another.
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