SEMICONDUCTOR CHIP PACKAGE ATTACHED ELECTRONIC DEVICE AND INTEGRATED CIRCUIT MODULE HAVING THE SAME

摘要

A semiconductor chip package on which an electronic device is mounted is provided to prevent or minimize a package crack or a solder joint crack by including an electronic device substituting for a support material at the edge or its adjacent portion of a semiconductor chip package. A semiconductor die is mounted on a support substrate in a semiconductor chip package(120). The semiconductor chip package can have a BGA package structure. A plurality of input/output bonding pads(122) are arranged at regular intervals on one surface of the support substrate, electrically connected to input/output pads of the semiconductor die. A plurality of device bonding pads are formed at the edge and/or its adjacent portion of one surface of the support substrate. Each device bonding pad can be electrically connected to a part of the input/output pads of the semiconductor die.