| 摘要 |
An integrated circuit, a method for forming the same are provided to facilitate core electric power and ground wiring and to accommodate high power applications without generating significant voltage drops using wire bonding mechanism between conductors of first and second substrates and a conductor of an integrated circuit die. An integrated circuit die(102) is attached to a first substrate(104). A second substrate(106) is allowed to overlie at least a portion of the integrated circuit die. At least one conductor of the second substrate is wire-bonded with a wire(108) to a conductor of the first substrate. The at least one conductor of the second substrate is electrically connected to a conductor of the integrated circuit die, and serves to provide a core electric power and a ground connection portion to the integrated circuit die. Before the integrated circuit die is attached to the first substrate, the second substrate is connected to the integrated circuit die. |
