| 摘要 |
A wire bonding device having a wire twisting member and a wire bonding method using the same are provided to adhere a wire onto a semiconductor chip and a board, while enhancing the rigidity of a wire loop. A capillary(140) has a through-hole through which a wire(120) passes. A clamp(150) is installed on an upper portion of the capillary, and holds the wire in a nippers manner. A wire twisting member(170) is installed on an upper portion of the clamp to rotate and twist the wire, and is spaced apart from the clamp at a given interval. The wire twisting member has a pair of stationary blocks(174) positioned at both sides of the wire and a rotating part(172) fastened to a lower portion of each stationary block.
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