Method for production and apparatus for production of adhesive wafer

摘要

A process for production and apparatus for production of an adhesive wafer which produce a wafer with an adhesive coated well over the entire back surface using a die attach film, wherein the wafer is placed on a table having substantially the same planar shape as the planar shape of the wafer and the entire back surface is heated, the die attach film is pressed against the back surface, and the separation film is peeled off from the wafer in the state with the adhesive heated through the wafer.