| 摘要 |
In an integrated circuit ( 1 ) having a substrate ( 3 ) and having a signal-processing circuit ( 4 ) which is produced at a surface ( 8 ) of the substrate ( 3 ), there is provided on the substrate surface ( 8 ) a protective layer ( 12 ) that has at least one aperture ( 13 ) through which a second contact pad ( 14 ) is electrically and mechanically connected to a first contact pad ( 9 ), wherein the second contact pad ( 14 ) is of a height of at least 15 mum and projects laterally beyond the aperture ( 13 ) on all sides and is seated on the protective layer ( 12 ) by an overlap zone (z) that is closed on itself like a ring, wherein the overlap zone (z) has a constant width of overlap (w) of between 2 mum and 15 mum, and wherein at least one element of the signal-processing circuit ( 4 ), and preferably only one capacitor ( 5 ) of the signal-processing circuit ( 4 ), is provided opposite the first contact pad ( 9 ).
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