发明名称 |
Radio frequency power amplifier module |
摘要 |
A radio frequency power amplifier module that brings sufficient attenuation to a radio frequency signal in a bias supply line connecting a bias control part and a radio frequency power amplifier part without increasing module substrate area is aimed. At least one bonding pad 106 having a capacitance component to a ground and stitch structure inductances 108, 109 composed of a bonding wire 105 provided via the bonding pad are provided in the bias supply line connecting the bias control part and the radio frequency power amplifier part.
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申请公布号 |
US7248118(B2) |
申请公布日期 |
2007.07.24 |
申请号 |
US20040830049 |
申请日期 |
2004.04.23 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
OHNISHI MASAMI;TANOUE TOMONORI;MATSUMOTO HIDETOSHI |
分类号 |
H03F3/24;H03G3/10;H03F1/02;H03F1/30;H03F3/195;H04B1/04 |
主分类号 |
H03F3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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