| 发明名称 |
Multi-step EBR process for photoresist removal |
| 摘要 |
An edge bead removal process is disclosed. The process includes providing a wafer having a feature layer, coating a photoresist on the feature layer, rotating the wafer, and removing an edge bead from the wafer by removing an edge bump portion from the edge bead and removing an edge region from the edge bead.
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| 申请公布号 |
US7247575(B2) |
申请公布日期 |
2007.07.24 |
| 申请号 |
US20040881340 |
申请日期 |
2004.06.30 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHENG CHIU SUNG;CHE WU MING;LEI HUNG SHIH;JUINN HUANG CHING |
| 分类号 |
H01L21/302;H01L21/461 |
主分类号 |
H01L21/302 |
| 代理机构 |
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