| 摘要 |
Boring device for boring via holes for connecting contact regions of a first layer of a multilayer printed circuit board to contact regions of a second layer of the circuit board includes boring device for boring the via holes and control device for generating control signals for controlling boring device in accordance with via holes to be bored. A device is provided for determining a layer-to-layer misalignment between the first and second layers of the circuit board. Device is connected to control device for feeding a signal representing determined layer-to-layer misalignment to control device, which generates control signals as a function of determined layer-to-layer misalignment so that boring device bores via holes as a function of determined layer-to-layer misalignment. Boring device includes at least one laser for forming the via holes. |
