METHOD FOR LABELING IDENTIFICATION NUMBER OF SEMICONDUCTOR WAFER

摘要

A method for labeling a wafer is provided to improve efficiency of wafer labeling work by minimizing movement of a cassette after the cassette is loaded into label equipment to allow a marking process of an identification number to be performed continuously. A cassette is loaded into label equipment(S10). The cassette receives a plurality of wafers. It is determined whether flat zones of the wafers loaded into the label equipment are aligned(S20). The wafers whose flat zones are aligned are arranged in a step manner(S30). A specific identification number is marked onto each of the arranged wafers by irradiating a laser beam onto the flat zones(S40). The wafers on which the specific identification numbers are marked are returned to initial positions in the cassette(S50). The cassette in which the returned wafers are received is unloaded from the label equipment(S60).