发明名称 Electronic component mounting apparatus and electronic component mounting method
摘要 In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.
申请公布号 US7246430(B2) 申请公布日期 2007.07.24
申请号 US20040857940 申请日期 2004.06.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 YONEZAWA TAKAHIRO;KOBAYASHI KEN;HASEGAWA MIKIO;NASU HIROSHI;IMANISHI MAKOTO;WATANABE KATSUHIKO
分类号 B23P19/00;B23Q15/00;H01L21/52;H01L21/58;H01L21/60;H05K13/04 主分类号 B23P19/00
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