发明名称 |
Frame for semiconductor package |
摘要 |
A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.
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申请公布号 |
US7247515(B2) |
申请公布日期 |
2007.07.24 |
申请号 |
US20040017896 |
申请日期 |
2004.12.21 |
申请人 |
DAINIPPON PRINTING CO., LTD. |
发明人 |
IKENAGA CHIKAO;TOMITA KOUJI |
分类号 |
H01L21/00;H01L21/56;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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