| 发明名称 |
Bonded three dimensional laminate structure |
| 摘要 |
A conductive structure and method of manufacturing therefor includes a plurality of stacked metal laminates secured to one another via an intermetallic bond made from a metallic bonding agent.
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| 申请公布号 |
US7247030(B2) |
申请公布日期 |
2007.07.24 |
| 申请号 |
US20040818038 |
申请日期 |
2004.04.05 |
| 申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
HILTY ROBERT DANIEL;MYERS MARJORIE KAY;LAUB MICHAEL FREDRICK |
| 分类号 |
H01R12/00;H01R9/24;H01R9/26;H01R13/52;H01R13/58;H01R13/648;H01R43/18 |
主分类号 |
H01R12/00 |
| 代理机构 |
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