发明名称 Substrate for electronic device, method for manufacturing substrate for electronic device, and electronic device
摘要 The invention provides a substrate for an electronic device including a conductive oxide layer which is formed by epitaxial growth with cubic crystal (100) orientation or pseudo-cubic crystal (100) orientation and which contains a metal oxide having a perovskite structure, a method for manufacturing a substrate for an electronic device, and an electronic device provided with such a substrate for an electronic device. A substrate for an electronic device includes a Si substrate, a buffer layer which is formed by epitaxial growth on the Si substrate and which contains a metal oxide having a NaCl structure, and a conductive oxide layer which is formed by epitaxial growth with cubic crystal (100) orientation or pseudo-cubic crystal (100) orientation on the buffer layer and which contains a metal oxide having a perovskite structure. The Si substrate is preferably a (100) substrate or a (110) substrate from which a natural oxidation film is not removed. The buffer layer preferably has an average thickness of 10 nm or less.
申请公布号 US7247551(B2) 申请公布日期 2007.07.24
申请号 US20040968957 申请日期 2004.10.21
申请人 SEIKO EPSON CORPORATION 发明人 HIGUCHI TAKAMITSU;IWASHITA SETSUYA;MIYAZAWA HIROMU
分类号 C01G55/00;H01L21/44;C30B23/02;C30B29/16;C30B29/24;H01L21/02;H01L21/28;H01L21/314;H01L21/316;H01L21/8246;H01L27/105;H01L29/04;H01L41/08;H01L41/09;H01L41/18;H01L41/22 主分类号 C01G55/00
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