FILM INTERCONNECTION SUBSTRATE, AND SEMICONDUCTOR CHIP PACKAGE AND PLAT PANEL DISPLAY USING THEREOF

摘要

A film wiring substrate, a semiconductor chip package using the same, and a flat panel display apparatus using the same are provided to increase an operational margin by increasing the capacitance between a power line and a grounding line. A flat display panel apparatus(100) using a film wiring substrate(120) includes a flat display panel(110) and a source drive PCB(Printed Circuit Board)(130). The source drive PCB(130) with a built-in power unit, a built-in memory unit, a built-in program unit, and a built-in buffer unit supplies a drive signal to the flat display panel(110). A semiconductor chip such as a source drive IC(Integrated Circuit)(140) is mounted on the film wiring substrate(120) to supply the drive signal from the source drive PCB(130) to the flat display panel(110). A plurality of signal lines(152) are connected between the source drive PCB(130) and the source drive IC(140) on the film wiring substrate(120).