| 摘要 |
An apparatus and a method of detecting errors in supplying a polishing agent of a chemical mechanical polishing apparatus are provided to improve a production yield of a semiconductor apparatus by automatically inspecting the quality and supply amount of polishing agent. An apparatus of detecting errors in supplying a polishing agent of a chemical mechanical polishing apparatus includes a detecting unit, and an error detection controlling unit(40). The detecting unit detects the change of friction force between a semiconductor wafer and a polishing pad. The error detection controlling unit compares the detection result of the detecting unit with upper and lower limits of a pre-set reference value, and determines as the errors in case that the detection result is over the upper limit of the reference value or under the lower limit of the reference value. The detecting unit includes a current detecting unit(20) for detecting current of a driving motor(10) of which supply current is changed according to the friction force between the semiconductor wafer and the polishing pad, and a signal converting unit(30) for converting the detection result of the current detecting unit to a signal recognizable in the error detection controlling unit.
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