发明名称 Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board
摘要 <p>The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 mum. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.</p>
申请公布号 KR100741615(B1) 申请公布日期 2007.07.23
申请号 KR20070026304 申请日期 2007.03.16
申请人 发明人
分类号 H05K3/46;B32B3/00;C09J7/02;H05K1/00;H05K3/00;H05K3/10;H05K3/28;H05K3/38 主分类号 H05K3/46
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