发明名称 SOLDER BALL ATTACH MACHINE AND CONTROL METHOD THEREOF
摘要 A machine and a method for attaching solder balls are provided to quickly and easily replace a solder ball cartridge according to various patterns of a substrate or wafer, thereby accurately seating the solder balls on an altered pattern. A first clamp(110) pneumatically holds a flux cartridge(40) having protruding pins corresponding to a pattern formed on a substrate or a wafer. A first transfer unit transfers the first clamp so that flux is adhered on the pins of the flux cartridge and then is adhered on the pattern. After a solder ball cartridge holds the solder balls, a second transfer unit transfers the solder balls onto the pattern. The first clamp has a first clamp body integrally secured to the first transfer unit and a grip block moved by a guide bar inserted in the first clamp body.
申请公布号 KR100742975(B1) 申请公布日期 2007.07.20
申请号 KR20070025451 申请日期 2007.03.15
申请人 KOREA SEMICINDUCTOR SYSTEM CO., LTD. 发明人 PARK, JUN HO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址