| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board with good heat resistance, excellent dielectric characteristics, and also excellent mounting reliability owing to high adhesion between layers. <P>SOLUTION: The method of manufacturing the printed wiring board includes: a step of forming a wiring layer on a conductive frame by electrolytic plating using the frame as a plating lead; a step of forming an insulation layer on the wiring layer forming surface of the conductive frame; a step of removing the frame; a step of providing a hole through the insulation layer; and a step of forming a conductor post having one of surfaces in contact with the wiring layer and the other surface as a protrusion through the insulation layer by filling the through hole with a conductive component. The insulating layer is constituted of a resin composition containing additional polynorbornene-based resin having a glycidyl-ether-type epoxy group and a thermal acid generator and is heat-cured. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
