| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for an electronic element having good fluidity in a narrow gap without forming voids and excellent fillet moldability and to provide an electronic element device sealed therewith and having high reliability (moisture resistance and thermal shock resistance). SOLUTION: The liquid resin composition for the electronic element is used for the electronic element. The liquid resin composition comprises (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) a nonionic surfactant and (D) an inorganic filler. COPYRIGHT: (C)2007,JPO&INPIT |
