Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same

摘要

A thermoplastic polyimide composition characterized by improved thermal resistance, adhesion and flatness for use in copper clad laminates. The polyimide contains repeating units represented by the formulae I and II, wherein each of Ar¹ and Ar², independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.