Light emitting diode packaging structure

摘要

A light emitting diode (LED) packaging structure includes a package body, a lead frame and a reflective wall. The package body includes a chip accommodating space for an LED chip, and a portion of the lead frame is exposed to the chip accommodating space. The reflective wall is connected with the lead frame and extendedly bends from the lead frame to cover a sidewall of the accommodating space so that rays of the LED chip can reflect from the reflective wall mostly.