| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure method which can expose a resist with a proper exposure amount without delaying exposure processing when processing a substrate consecutively in a lithography process. <P>SOLUTION: The exposure method is used to expose the resist having been applied onto the substrate by one of a plurality of resist coating units. The method includes a selecting step S104 for choosing an exposure amount pattern on the substrate, on the basis of a resist coating unit data that specifies which unit among the plurality of resist coating units should be used to apply a resist onto the substrate; and an exposure step S105 for exposing the resist on the substrate in accordance with the exposure amount pattern chosen by the selecting step. <P>COPYRIGHT: (C)2007,JPO&INPIT |
