发明名称 |
LIGHT-EMITTING DIODE PACKAGE STRUCTURE |
摘要 |
A light-emitting diode package structure is provided. The light-emitting diode package comprises an insulating sub-mount, a first patterned conductive-reflective film, a second patterned conductive-reflective film and a light-emitting diode chip. The insulating sub-mount has a first surface and a cavity therein. The first and the second patterned conductive-reflective film are set over a portion of the first surface, a portion of the sidewalls of the cavity and a portion of the bottom surface of the cavity. The light-emitting diode chip is set up inside the cavity of the insulating sub-mount. The light-emitting diode has a pair of electrodes. The electrodes are electrically connected to the first and the second patterned conductive-reflective film respectively. Since the light-emitting diode structure of this invention incorporates the patterned conductive-reflective films, efficiency of the light-emitting diode is increased.
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申请公布号 |
US2007165414(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20070682165 |
申请日期 |
2007.03.05 |
申请人 |
SHEI SHIH-CHANG;SHEU JINN-KONG |
发明人 |
SHEI SHIH-CHANG;SHEU JINN-KONG |
分类号 |
F21V15/00;H01L23/02;H01L25/16;H01L29/18;H01L33/60;H01L33/62 |
主分类号 |
F21V15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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