发明名称 Photosensitive resin composition and manufacturing method of semiconductor device using the same
摘要 A positive photosensitive resin composition, which contains a polybenzoxazole precursor capable of increasing alkali solubility by an action of an acid, a triarylsulfonium salt and a sensitizer; and a method of manufacturing a semiconductor device using the composition.
申请公布号 US2007166643(A1) 申请公布日期 2007.07.19
申请号 US20060645554 申请日期 2006.12.27
申请人 FUJIFILM CORPORATION 发明人 SATO KENICHIRO;YAMANAKA TSUKASA;TSUCHIMURA TOMOTAKA
分类号 G03C1/00 主分类号 G03C1/00
代理机构 代理人
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