| 摘要 |
A semiconductor package including a die, a substrate and bumps is provided. The die has die pads arranged on an active surface thereof and a first passivation layer. The first passivation layer is disposed on the active surface and has first openings for exposing the die pads, respectively. The substrate has a substrate surface, substrate pads and a second passivation layer. The substrate pads are arranged on the substrate surface. The second passivation layer is arranged on the substrate surface and has a second opening for exposing the substrate pads and a portion of the substrate surface. The bumps are arranged on the die pads, respectively. Each bump is connected to one of the substrate pads through a compression bonding process, and the die is electrically connected to the substrate through the bumps. A distance between the first passivation layer and the substrate pads is smaller than 50 mum.
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