THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

A three-dimensional circuit board (10) comprises a board (20), a first wiring-electrode group (30) provided on a plurality of steps above the board (20), and a second wiring-electrode group (40) connected to the first wiring-electrode group (30) in an altitude direction, wherein at least connecting portions between the first and second wiring-electrode groups (30) and (40) are integrated in a continuously identical shape.