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经营范围
发明名称
Multi-chip semiconductor package
摘要
A multi-chip semiconductor package that includes two power semiconductor devices arranged in a half-bridge configuration between two opposing circuit boards.
申请公布号
US2007164423(A1)
申请公布日期
2007.07.19
申请号
US20070653579
申请日期
2007.01.16
申请人
STANDING MARTIN
发明人
STANDING MARTIN
分类号
H01L23/34
主分类号
H01L23/34
代理机构
代理人
主权项
地址
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