| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package in which high heat radiation effect can be obtained even if it is miniaturized, and which can be formed to be thin and flat, by integrally installing a cooling section in the package, and to provide a forming method of the package. SOLUTION: The cooling section 20 is integrally arranged on the other face 1b-side in the package 1 where a recess 2 for storing an electronic component 8 is depressed and formed on one face 1a-side of a metal plate 12. The cooling section 20 is provided with a crowned member 5 which is crowned to the 1b-side in the other face of the package 1, and is formed in an almost plate shape, plate-like fins 3 of a plurality of bars which are integrally and protrusively formed from one inner face of the package 1, and grooves 4 formed between the fins 3. A flow-in port 7 and a flow-out port 8 are provided for making cooling fluid flow into a hollow part, circulating the groove 4 and making it flow out in the crowned member 5 corresponding by formed to both sides of the grooves 4. COPYRIGHT: (C)2007,JPO&INPIT |
