| 摘要 |
PROBLEM TO BE SOLVED: To shorten the execution time in situ of a high purity gas supply system in a semiconductor manufacturing apparatus. SOLUTION: In the execution method of surface cleaning parts, while flowing a high purity inactive gas, a plurality of surface cleaning parts 2c are assembled along the direction of gas flow from the upstream side to the downstream side. The surface cleaning part 2c is filled with a high purity inactive gas and sealed without being exposed to atmosphere after subjected to a predetermined surface cleaning. COPYRIGHT: (C)2007,JPO&INPIT
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