| 摘要 |
PROBLEM TO BE SOLVED: To improve height measurement accuracy at an optional measuring object point on the mounting surface (board surface) of a circuit board, and to shorten a processing time. SOLUTION: Height measuring points 12, 13 to the number of four or more in total are arranged on the board surface so as to be dispersed approximately equally on the whole board surface. After measuring all the height measuring points 12, 13, three adjacent height measuring points 12 or 13 are selected from among the height measuring points 12, 13, and processing for forming a triangular domain having the three height measuring points 12 or 13 as vertexes is repeated, to thereby divide the board surface into a plurality of triangular domains. Then, after selecting a triangular domain including the measuring object point whose height is to be actually measured from among the plurality of triangular domains, the height of the measuring object point within the triangular domain is calculated by interpolation calculation based on each height measured value of the three vertexes (height measuring points 12 or 13) of the triangular domain including the measuring object point. COPYRIGHT: (C)2007,JPO&INPIT
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