发明名称 Head or bottom element of a component support
摘要 A head or bottom element of a component support, having guide rails which are arranged side-by-side and aligned in an insertion direction for receiving a printed circuit board of a plug-in module. The guide rails are constituted or formed by one-piece guide elements of the head or bottom element. The head or bottom element includes an electrically conductive material at least over portions of its area. If the head or bottom element has a surface coating of electrically non-conductive material, at least partially in the area of the guide rail, it is then possible to achieve a dependable insulation of the printed circuit board from the head or bottom element in a simple and cost-effective manner.
申请公布号 US2007167070(A1) 申请公布日期 2007.07.19
申请号 US20060604175 申请日期 2006.11.22
申请人 WALTZ EIKE;KORBER WERNER;SCHAFFER KURT 发明人 WALTZ EIKE;KORBER WERNER;SCHAFFER KURT
分类号 H01R13/60 主分类号 H01R13/60
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