| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism capable of easily lifting and lowering a test head having an extremely heavy weight in a wafer probing. SOLUTION: An automatic lifting-lowering manipulator capable of lengthening or shortening its own length in the vertical direction is constituted by using an automatic output mechanism 520. A load device (such as a measuring test head) can be lifted or lowered by winding a transmission rope at the upper edge of a first (fixed) pulley and the lower edge of a second (moving) pulley by using a double-process principle. When the output mechanism generates a specific displacement, the height of an automatic lifting-lowering control mechanism 510 is reduced because the load device can be lifted or lowered as a double displacement. COPYRIGHT: (C)2007,JPO&INPIT
|
