RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having good adhesiveness and good electrical conductivity when bonding a semiconductor element or a radiation member to a support such as a lead frame plated with Ni-Pd and to provide a semiconductor device not causing peeling and excellent in reliability even when carrying out high temperature reflow or temperature cycle test by using the resin composition for adhesion of the semiconductor element or adhesion of a heat radiation member. SOLUTION: The resin composition is used for bonding the semiconductor element or the heat radiation member to the support. The resin composition comprises (A) silver powder, (B) an epoxy resin, (C) a compound represented by general formula (1) [wherein n is 0 or 1; R1is hydrogen, a methyl group, an ethyl group or a functional group represented by general formula (2) (R7and R8are each one kind of group selected from hydrogen, a methyl group, an ethyl group and an allyl group and R7and R8may each be same or different); R2is hydrogen, a methyl group or ethyl group; R3to R6are each one kind of group selected from hydrogen, a methyl group and an allyl group and R3and R6may each be same or different] and (D) a compound represented by general formula (3) [wherein R9and R11are each a 1-10C alkoxy group and R9and R11may each be same or different; R10and R12are each 1-10C alkyl group and R10and R12may each be same or different; (a) and (b) are each an integer of 1-3; ml and m2 are each an integer of 1-5 and m3 is an integer of 2-4]. COPYRIGHT: (C)2007,JPO&INPIT