| 摘要 |
PROBLEM TO BE SOLVED: To provide a halogen-free resin composition excellent in the filling property of penetrated hole and heat resistance, having a low dielectric constant of its cured material, and a prepreg and printed wiring board by using the same. SOLUTION: This halogen-free resin composition containing (a) spherical silica having 0.4 to 4μm mean particle diameter, (b) an epoxy resin having a novolac structure and (c) an aminotriazine novolac resin-curing agent having 16 to 22 mass% nitrogen content, and (d) without containing a halogen is provided by containing a phosphorus-containing flame retardant showing≤1.0 mass% mass reduction by thermal decomposition at 300°C, and also showing 3.0-3.5 relative dielectric constant of its cured material at 1 GHz frequency. COPYRIGHT: (C)2007,JPO&INPIT
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